Title :
Successful failure analysis using fault diagnosis tool and product characterization board in BiCMOS technology low yield investigation
Author :
Liu, Richard ; Chin, Alvin ; Seah Pei Hong ; Lee Wenfeng
Author_Institution :
Syst. on Silicon Manuf. Co. Pte. Ltd., Singapore, Singapore
Abstract :
The conventional failure analysis methods are not efficient in analyzing Systems on Chip (SoC) ICs. Electrical failure analysis using a Fault Diagnosis Tool (FDT) and Product Characterization Board can help to precisely localize the defect. Failure analysis of two BiCMOS products using these methods will be demonstrated in this paper. Detail analysis of using these two methods are presented and discussed.
Keywords :
BiCMOS digital integrated circuits; failure analysis; integrated circuit reliability; system-on-chip; BiCMOS technology; FDT; SoC IC; conventional failure analysis method; defect localization; electrical failure analysis; fault diagnosis tool; low-yield investigation; product characterization board; systems-on-chip IC; Decision support systems; Failure analysis; Integrated circuits;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599238
