DocumentCode :
633903
Title :
Channel Hot-Carrier degradation characteristics and trap activities of high-k/metal gate nMOSFETs
Author :
Weichun Luo ; Hong Yang ; Wenwu Wang ; Hao Xu ; Shangqing Ren ; Bo Tang ; Zhaoyun Tang ; Jing Xu ; Jiang Yan ; Chao Zhao ; Dapeng Chen ; Ye Tianchun
Author_Institution :
Key Lab. of Microelectron. Devices & Integrated Technol., Inst. of Microelectron., Beijing, China
fYear :
2013
fDate :
15-19 July 2013
Firstpage :
666
Lastpage :
669
Abstract :
In this paper, the Hot-Carrier (HC) degradation characteristics and mechanisms of nMOSFETs with high-k/metal gate (HK/MG) structure are systematically investigated. The Idsat shift under different Vd states obeys power-law of Vg stress time, and the exponent of Vg stress time shifts from 0.5~0.7 at low stress to 0.2~0.3 at high stress, which is believed to be induced by different trap activities. There are two transitions in the curve of time to fail (TTF) and Vg stress, the 1st valley point is resulted from impact ionization, and the 2nd transition is attributed to the dominant roles exchange of the interface trap (Nit) and bulk trap (Not) in dielectric in degradation.
Keywords :
MOSFET; high-k dielectric thin films; hot carriers; impact ionisation; interface states; HK-MG structure; TTF curve; bulk trap; channel hot-carrier degradation characteristics; current shift; first valley point; high-k-metal gate nMOSFET mechanism; impact ionization; interface trap; second transition; time-to-fail curve; trap activities; voltage states; voltage stress time; Degradation; Failure analysis; Impact ionization; Integrated circuits; Stress; Substrates; Threshold voltage; CHC degradation; HK/MG; Nit; Not;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
ISSN :
1946-1542
Print_ISBN :
978-1-4799-1241-4
Type :
conf
DOI :
10.1109/IPFA.2013.6599248
Filename :
6599248
Link To Document :
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