A waveform soft model extraction method to track wire behavior in nano scale technologies

In this paper a new method to extract the output waveform of interconnection wires in VLSI circuits is introduced. Multiple segments of a wire when used for model extraction usually result in more complexity in the final transfer function and exhaustive calculations for wire responses such as delay and power. The proposed method uses several segments of a wire and avoids complexity in the modelling expressions for waveform computations. The wire resistance, inductance, and capacitance are considered in the wire model, while input and output drivers are modelled with simple resistance and capacitance, respectively. The obtained results are compared with enough number of segments. The estimated error for the time delay when the output signal reaches to its 50% maximum value is less than 5% for the worst case.