Title :
Table of contents
Abstract :
The following topics are dealt with: transistor application technology; low-power ultrahigh-speed wireless communication; short-millimeter-wave CMOS technology; nanoimprinted-textured solar cell; ohmic contact formation; low temperature annealing; sputtering method; one-dimensional photonic crystal; bio-impedance measurement; digital ultrasonic sensors; power amplifier; small-scale inverter chains; and SRAM operation margin.
Keywords :
CMOS integrated circuits; SRAM chips; invertors; low-power electronics; millimetre wave integrated circuits; photonic crystals; power amplifiers; radiocommunication; solar cells; sputtering; transistors; SRAM operation margin; bio-impedance measurement; digital ultrasonic sensors; dimensional photonic crystal; low temperature annealing; low-power ultrahigh-speed wireless communication; nanoimprinted-textured solar cell; ohmic contact formation; power amplifier; short-millimeter-wave CMOS technology; small-scale inverter chains; sputtering method; transistor application technology;
Conference_Titel :
Future of Electron Devices, Kansai (IMFEDK), 2013 IEEE International Meeting for
Conference_Location :
Suita
Print_ISBN :
978-1-4673-6106-4
DOI :
10.1109/IMFEDK.2013.6602218
