Title :
An ultra-thin CMOS in-plane stress sensor
Author :
Mahsereci, Yigit U. ; Wacker, Nicoleta ; Richter, H. ; Burghartz, Joachim N.
Author_Institution :
CHIPS, Inst. fur Mikroelektron. Stuttgart, Stuttgart, Germany
Abstract :
This paper presents a CMOS stress sensor for uniaxial, in-plane flex measurement. The sensor is to be fabricated as an ultra-thin chip in order to adapt to surface shape. The sensor generates 2×10-bit data from piezo-resistive elements, via on chip stress insensitive readout circuitry. Unlike the directional selectivity of the strain gauges, the uniaxial in-plane stress vector can be measured in any direction by this sensor. In addition, the MOSFET stress macro model used for the sensor flex simulations is presented. It is used for the sensor flex simulations. It supports DC, AC, and transient analysis with any analog simulator.
Keywords :
CMOS integrated circuits; MOSFET; measurement systems; sensors; AC analysis; DC analysis; MOSFET stress macro model; analog simulator; chip stress insensitive readout circuitry; complementary metal oxide semiconductor stress sensor; directional selectivity; in-plane flex measurement; piezoresistive elements; sensor flex simulations; strain gauges; surface shape; transient analysis; ultra-thin CMOS in-plane stress sensor; uniaxial in-plane stress vector; uniaxial measurement; CMOS integrated circuits; MOSFET; Semiconductor device modeling; Sensors; Silicon; Stress; flexible electronics; piezo-resistive effect; stress sensor; stress simulation; ultra-thin chip;
Conference_Titel :
Ph.D. Research in Microelectronics and Electronics (PRIME), 2013 9th Conference on
Conference_Location :
Villach
Print_ISBN :
978-1-4673-4580-4
DOI :
10.1109/PRIME.2013.6603172