DocumentCode
63462
Title
Modeling the thermal conductivity of polymeric composites based on experimental observations
Author
Tsekmes, I.A. ; Kochetov, R. ; Morshuis, P.H.F. ; Smit, J.J.
Author_Institution
Dept. of Intell. Electr. Power Grids, Delft Univ. of Technol., Delft, Netherlands
Volume
21
Issue
2
fYear
2014
fDate
Apr-14
Firstpage
412
Lastpage
423
Abstract
One approach to increase the low thermal conductivity of polymers is to add nanosized or microsized fillers with relatively high thermal conductivity. The concept of nanodielectrics is based on the fact that the dielectric behaviour of polymeric composites is tailored on or dictated by nanoscale manipulation. In this paper, the role of fillers in the thermal conductivity of polymeric composites is investigated and reference is made to a number of different studies. The main goal is to determine potential trends governing or dictating the process of thermal conduction in polymeric composites including nanocomposites and microcomposites. Shape, size and thermal conductivity are some of the particle properties considered. Also, the crucial role of interfaces and agglomerations of particles is discussed. Finally, three dimensional models are implemented in Comsol Multiphysics in order to demonstrate the experimental observations and fit the experimental results on the thermal conductivity of epoxy nanocomposites.
Keywords
filled polymers; nanocomposites; particle size; resins; thermal conductivity; Comsol multiphysics; dielectric behaviour; epoxy nanocomposites; microcomposites; microsized fillers; nanodielectrics; nanoscale manipulation; nanosized fillers; particle agglomerations; particle interfaces; particle properties; particle size; polymeric composites; polymers; thermal conductivity; three-dimensional models; Conductivity; Heating; Nanocomposites; Plastics; Polymers; Thermal conductivity; 3D modeling; Comsol; Nanocomposites; epoxy; thermal conductivity;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2013.004142
Filename
6783031
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