Efficient heat dissipation in optoelectronic transmitter modules using thermally enhanced PCB

Author

Ukaegbu, I.A. ; Tae-Woo Lee ; Mu-Hee Cho ; Hyo-Hoon Park ; Sangirov, J.

Author_Institution

Dept. of Electr. Eng., KAIST, Daejeon, South Korea

fYear

2012

fDate

11-14 Sept. 2012

Firstpage

1

Lastpage

3

Abstract

This work demonstrates the thermal analysis for efficient heat dissipation for optoelectronic transmitter modules. A Teflon-based thermal printed circuit board (PCB) has been designed for packaging the designed and fabricated transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below 40 °C which is apt for reliable signal transmission.

Keywords

cooling; electronics packaging; integrated optoelectronics; optical design techniques; optical fabrication; optical transmitters; printed circuits; thermal analysis; Teflon-based thermal printed circuit board; chips; heat dissipation; optoelectronic transmitter modules; packaging; performance analysis; reliable signal transmission; thermal analysis; thermally enhanced PCB; Conductivity; Heating; Materials; Reliability engineering; Thermal conductivity; Optical interconnection; crosstalk; multi-chip transmitter module; planar transmitter module; thermal PCB;

fLanguage

English

Publisher

ieee

Conference_Titel

Photonics in Switching (PS), 2012 International Conference on

Conference_Location

Ajaccio

Type

conf

Filename

6608336