DocumentCode :
636136
Title :
Numerical simulation of dry and wet oxidation of Silicon by TCAD Sprocess
Author :
Anusha, A. ; Parameswaran, Chithra ; Revathi, P. ; Velmurugan, V.
Author_Institution :
Center for Nanotechnolgy Res., VIT Univ., Vellore, India
fYear :
2013
fDate :
24-26 July 2013
Firstpage :
513
Lastpage :
516
Abstract :
The oxide thickness is of great concern today. The basic idea is to grow SiO2 layer on Silicon. The oxide is grown on intrinsic silicon substrate by thermal oxidation i.e., wet oxidation and dry oxidation. The thickness is compared for both the oxidation processes after different oxidation cycles. The capacitance per unit length is also calculated for the oxide growth in above. The percentage oxide thickness is also estimated and the oxide is found to grow more into the substrate with time and number of cycles.
Keywords :
elemental semiconductors; numerical analysis; oxidation; semiconductor growth; silicon; Si; TCAD process; dry oxidation; intrinsic silicon substrate; numerical simulation; oxide growth; oxide thickness; thermal oxidation; wet oxidation; Electronic publishing; Information services; Internet; Oxidation; Dry Oxidation; Massoud Model; Thickness; Wet Oxidation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Nanomaterials and Emerging Engineering Technologies (ICANMEET), 2013 International Conference on
Conference_Location :
Chennai
Print_ISBN :
978-1-4799-1377-0
Type :
conf
DOI :
10.1109/ICANMEET.2013.6609351
Filename :
6609351
Link To Document :
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