DocumentCode
636205
Title
Integrated slanted microneedle-LED array for optogenetics
Author
Ki Yong Kwon ; Khomenko, Anton ; Haq, Mahmoodul ; Wen Li
Author_Institution
Electr. & Comput. Eng. Dept., Michigan State Univ., East Lansing, MI, USA
fYear
2013
fDate
3-7 July 2013
Firstpage
249
Lastpage
252
Abstract
This paper presents a three-dimensional (3-D) flexible micro light emitting diode (μ-LED) array for selective optical stimulation of cortical neurons. The array integrated individually addressable μ-LED chips with slanted polymer-based microneedle waveguides to allow precise light delivery to multiple cortical layers simultaneously. A droplet backside exposure method was developed to monolithically fabricate slanted microneedles on a single polymer platform. A wafer-level assembly technique was demonstrated, which permits large-scale, high-density system integration. The electrical, optical, thermal, and mechanical properties of the 3-D slanted microneedle-LED array were characterized experimentally.
Keywords
bio-optics; bioMEMS; cellular biophysics; light emitting diodes; micro-optics; microfabrication; neurophysiology; optical waveguides; 3D flexible microLED array; A droplet backside exposure method; array integrated microLED chips; cortical layers; cortical neuron selective optical stimulation; individually addressable microLED chips; integrated slanted microneedle-LED array; large scale high density system integration; light emitting diode; microneedle-LED array electrical properties; microneedle-LED array mechanical properties; microneedle-LED array optical properties; microneedle-LED array thermal properties; optogenetics; precise light delivery; single polymer platform; slanted microneedle monolithic fabrication; slanted polymer based microneedle waveguides; wafer level assembly technique; Arrays; Light emitting diodes; Optical device fabrication; Optical scattering; Optical waveguides; Stimulated emission; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6609484
Filename
6609484
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