Title :
Spiral peripheral nerve interface; updated fabrication process of the regenerative implant
Author :
Barrett, Richard ; Benmerah, Samia ; Frommhold, Andreas ; Tarte, Edward
Author_Institution :
Sch. of Electron., Electr. & Comput. Eng., Univ. of Birmingham, Birmingham, UK
Abstract :
The spiral peripheral nerve interface (SPNI) has been developed to record neural activity by utilizing the body´s own ability to regenerate axons after injury. The implantable device is capable of providing a chronic recording array for use with technology designed to compensate for a loss of motor function. The SPNI offers a good route to establishing an effective interface to the peripheral nervous system (PNS) as the signals are enclosed within an insulating array that amplifies the axon signals for the neural recording, and reduces the amount of current necessary for stimulation. This paper presents an updated fabrication process that addresses the problems of previous designs and allows for an easier integration to external electronics via a ball-bonding technique. The updated device has been tested electrically in vitro, to show that it is capable of providing a reliable electrical interface to the regenerated tissue.
Keywords :
bioelectric potentials; biological tissues; biomedical electronics; cellular biophysics; lead bonding; neurophysiology; prosthetics; SPNI integration; axon regeneration; axon signal amplification; ball bonding technique; chronic recording array; current reduction; electrical interface; external electronics; implantable device; in vitro electrical testing; injury; motor function compensation; motor function loss; neural activity recording; neural recording; neural stimulation; peripheral nervous system; regenerative implant fabrication process; spiral peripheral nerve interface; tissue regeneration; Arrays; Electrodes; Fabrication; Gold; Impedance; Nerve fibers; Substrates;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
DOI :
10.1109/EMBC.2013.6609614