Title :
Dielectric breakdown strength of epoxy bimodal-polymer-brush-grafted core functionalized silica nanocomposites
Author :
Virtanen, S. ; Krentz, Timothy M. ; Nelson, J.K. ; Schadler, Linda S. ; Bell, Michael ; Benicewicz, Brian ; Hillborg, Henrik ; Su Zhao
Author_Institution :
Dept. of Chem., Univ. of Jyvaskyla, Jyvaskyla, Finland
Abstract :
The central goal of dielectric nanocomposite design is to create a large interfacial area between the matrix polymer and nanofillers and to use it to tailor the properties of the composite. The interface can create sites for trapping electrons leading to increased dielectric breakdown strength (DBS). Nanoparticles with a bimodal population of covalently anchored molecules were created using ligand engineering. Electrically active short molecules (oligothiophene or ferrocene) and matrix compatible long poly(glycidyl methacrylate) (PGMA) chains comprise the bimodal brush. The dielectric breakdown strength was evaluated from recessed samples and dielectric spectroscopy was used to study the dielectric constant and loss as a function of frequency. The dielectric breakdown strength and permittivity increased considerably with only 2 wt% filler loading while the dielectric loss remained comparable to the reference epoxy.
Keywords :
dielectric losses; electric breakdown; filled polymers; nanocomposites; nanoparticles; particle reinforced composites; permittivity; silicon compounds; SiO2; bimodal brush; bimodal population; covalently anchored molecules; dielectric breakdown strength; dielectric constant; dielectric loss; dielectric nanocomposite design; dielectric spectroscopy; electrically active short molecules; epoxy bimodal-polymer-brush-grafted core functionalized silica nanocomposites; ferrocene; large interfacial area; matrix polymer; nanofillers; nanoparticles; oligothiophene; permittivity; poly(glycidyl methacrylate) chains; trapping electrons; Brushes; Dielectric breakdown; Dielectrics; Nanoparticles; Polymers; Satellite broadcasting; Silicon compounds;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2014.004415