Title :
Nonlinear coil sensitivity estimation for parallel magnetic resonance imaging using data-adaptive steering kernel regression method
Author :
Sheng Fang ; Hua Guo
Author_Institution :
Inst. of Nucl. & New Energy Technol., Tsinghua Univ., Beijing, China
Abstract :
The parallel magnetic resonance imaging (parallel imaging) technique reduces the MR data acquisition time by using multiple receiver coils. Coil sensitivity estimation is critical for the performance of parallel imaging reconstruction. Currently, most coil sensitivity estimation methods are based on linear interpolation techniques. Such methods may result in Gibbs-ringing artifact or resolution loss, when the resolution of coil sensitivity data is limited. To solve the problem, we proposed a nonlinear coil sensitivity estimation method based on steering kernel regression, which performs a local gradient guided interpolation to the coil sensitivity. The in vivo experimental results demonstrate that this method can effectively suppress Gibbs ringing artifact in coil sensitivity and reduces both noise and residual aliasing artifact level in SENSE reconstruction.
Keywords :
biomedical MRI; coils; data acquisition; image denoising; image reconstruction; image resolution; interpolation; medical image processing; regression analysis; sensitivity; Gibbs-ringing artifact; MRI data acquisition time; SENSE reconstruction; coil sensitivity data resolution; data-adaptive steering kernel regression method; image denoising; linear interpolation techniques; local gradient guided interpolation; multiple receiver coils; nonlinear coil sensitivity estimation; parallel imaging reconstruction; parallel magnetic resonance imaging; residual aliasing artifact level; resolution loss; Coils; Estimation; Image reconstruction; Image resolution; Imaging; Kernel; Sensitivity; Algorithms; Humans; Image Processing, Computer-Assisted; Magnetic Resonance Imaging; Nonlinear Dynamics; Regression Analysis;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
DOI :
10.1109/EMBC.2013.6609696