Title :
Comparative evaluation of an ambulatory EEG platform vs. clinical gold standard
Author :
Jackson, G. ; Radhu, Natasha ; Yinming Sun ; Tallevi, Kevin ; Ritvo, Paul ; Daskalakis, Zafiris J. ; Grundlehner, Bernard ; Penders, Julien ; Cafazzo, Joseph A.
Author_Institution :
Inst. of Biomater. & Biomed. Eng., Univ. of Toronto, Toronto, ON, Canada
Abstract :
Electroencephalography (EEG) testing in clinical labs makes use of large amplifiers and complex software for data acquisition. While there are new ambulatory electroencephalogram (EEG) systems, few have been directly compared to a gold standard system. Here, an ultra-low power wireless EEG system designed by Imec is tested against the gold standard Neuroscan SynAmps2 EEG system, recording simultaneously from the same laboratory cap prepared with electrode gel. The data was analyzed using correlation analysis for both time domain and frequency domain data. The analysis indicated a high Pearson´s correlation coefficient (mean=0.957, median=0.985) with high confidence (mean P=0.002) for 10-second sets of data transformed to the frequency domain. The time domain results had acceptable Pearson´s coefficient (mean=0.580, median =0.706) with high confidence (mean P=0.008).
Keywords :
biomedical electrodes; correlation methods; data acquisition; data analysis; electroencephalography; gels; medical signal processing; time-frequency analysis; Imec; Pearson correlation coefficient; ambulatory EEG platform; ambulatory electroencephalogram systems; amplifiers; clinical gold standard; comparative evaluation; complex software; correlation analysis; data acquisition; data analysis; electrode gel; electroencephalography testing; frequency domain data; standard euroscan SynAmps2 EEG system; time domain data; ultralow power wireless EEG system; Correlation; Electrodes; Electroencephalography; Frequency-domain analysis; Standards; Testing; Wireless communication;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
DOI :
10.1109/EMBC.2013.6609727