DocumentCode
636377
Title
Local effect of compression stockings on skin microcirculatory activity through the measurement of skin effective thermal conductivity
Author
Grenier, Etienne ; Gehin, C. ; Lun, Bertrand ; McAdams, Eric
Author_Institution
Biomed. Sensors Group, INSA-Lyon, Villeurbanne, France
fYear
2013
fDate
3-7 July 2013
Firstpage
1768
Lastpage
1771
Abstract
This paper presents a preliminary study to demonstrate the instantaneous local effect of compression stocking (Class 2) on skin microcirculatory activity. The measurement needs to be carefully performed as the sensor is placed under the garment. To assess the local effect of compression stockings, we use the ambulatory device Hematron located on the calf under the garment. Skin microcirculatory activity is assessed through the skin´s effective thermal conductivity measurement. A specific housing for the sensor has been designed to avoid excessive pressure induced by the sensor when squeezed by stockings. The experiment, conducted on ten healthy subjects, comprised two stages: without and with compression stockings. Skin effective thermal conductivity was recorded at three successive positions (supine, sitting and standing). Significant improvement in skin microcirculatory activity was recorded by the Hematron device for the three positions. We have also demonstrated that Hematron sensor can be used under compression stockings.
Keywords
bioelectric phenomena; biomechanics; biomedical measurement; skin; temperature sensors; thermal conductivity measurement; ambulatory Hematron sensor; compression stocking effect; garment; sitting position; skin effective thermal conductivity measurement; skin effective thermal conductivity recording; skin microcirculatory activity assessement; standing position; supine position; Blood; Conductivity; Conductivity measurement; Conferences; Heating; Skin; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6609863
Filename
6609863
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