• DocumentCode
    636403
  • Title

    Microwave technology for localization of traumatic intracranial bleedings—A numerical simulation study

  • Author

    Candefjord, Stefan ; Winges, J. ; Yinan Yu ; Rylander, T. ; McKelvey, Tomas

  • Author_Institution
    Dept. of Signals & Syst., Chalmers Univ. of Technol., Gothenburg, Sweden
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    1948
  • Lastpage
    1951
  • Abstract
    Traumatic brain injury (TBI) is a major public health problem worldwide. Intracranial bleedings represents the most serious complication of TBI and need to be surgically evacuated promptly to save lives and mitigate injury. Microwave technology (MWT) is promising as a complement to computed tomography (CT) to be used in road and air ambulances for early detection of intracranial bleedings. In this study, we perform numerical simulations to investigate if a classification algorithm based on singular value decomposition can distinguish between bleedings at different positions adjacent to the skull bone for a similar but simplified problem. The classification accuracy is 94-100% for all classes, a result that encourages us to pursue our efforts with MWT for more realistic scenarios. This indicates that MWT has potential for localizing a detected bleeding, which would increase the diagnostic value of this technique.
  • Keywords
    bone; brain; injuries; numerical analysis; patient diagnosis; singular value decomposition; classification algorithm; computed tomography; microwave technology; numerical simulation; public health problem; singular value decomposition; skull bone; surgery; traumatic brain injury; traumatic intracranial bleeding detection; traumatic intracranial bleeding localization; Hemorrhaging; Microwave imaging; Microwave measurement; Microwave technology; Numerical models; Numerical simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6609909
  • Filename
    6609909