• DocumentCode
    636505
  • Title

    Neuromuscular junction in a microfluidic device

  • Author

    Hyun Sung Park ; Su Liu ; McDonald, John ; Thakor, Nitish ; In Hong Yang

  • Author_Institution
    Dept. of Biomed. Eng., Johns Hopkins Univ., Baltimore, MD, USA
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    2833
  • Lastpage
    2835
  • Abstract
    Malfunctions at the site of neuromuscular junction (NMJ) of post-injuries or diseases are major barriers to recovery of function. The ability to efficiently derive motor neurons (MN) from embryonic stem cells has indicated promise toward the development of new therapies in increasing functional outcomes post injury. Recent advances in micro-technologies have provided advanced culture platforms allowing compartmentalization of sub-cellular components of neurons. In this study, we combined these advances in science and technology to develop a compartmentalized in vitro NMJ model. The developed NMJ system is between mouse embryonic stem cell (mESC)-derived MNs and c2c12 myotubes cultured in a compartmentalized polydimethylsiloxane (PDMS) microfluidic device. While some functional in vitro NMJ systems have been reported, this system would further contribute to research in NMJ-related diseases by providing a system to study the site of action of NMJ aimed at improving promoting better functional recovery.
  • Keywords
    bioMEMS; cellular biophysics; microfluidics; neurophysiology; tissue engineering; c2c12 myotubes; compartmentalized PDMS microfluidic device; compartmentalized in vitro NMJ model; culture platforms; embryonic stem cells; functional recovery; mESC derived motor neurons; microtechnologies; mouse embryonic stem cell; neuromuscular junction; neuron subcellular component compartmentalization; polydimethylsiloxane; post injury functional outcome; Diseases; In vitro; Manganese; Microchannel; Muscles; Nerve fibers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6610130
  • Filename
    6610130