Title :
Superficial heat reduction technique for a hybrid microwave-optical device
Author :
Al-Armaghany, A. ; Tong, Kin-Fai ; Leung, T.S.
Author_Institution :
Dept. of Electron. & Electr. Eng., Univ. Coll. London, London, UK
Abstract :
Microwave applicator in the form of a circularly polarized microstrip patch antenna is proposed to provide localized deep heating in biological tissue, which causes blood vessels to dilate leading to changes in tissue oxygenation. These changes are monitored by an integrated optical system for studying thermoregulation in different parts of the human body. Using computer simulations, this paper compares circularly and linearly polarized antennas in terms of the efficiency of depositing electromagnetic (EM) energy and the heating patterns. The biological model composes of the skin, fat and muscle layers with appropriate dielectric and thermal properties. The results show that for the same specific absorption rate (SAR) in the muscle, the circularly polarized antenna results in a lower SAR in the skin-fat interface than the linearly polarized antenna. The thermal distribution is also presented based on the biological heat equation. The proposed circularly polarized antenna shows heat reduction in the superficial layers in comparison to the linearly polarized antenna.
Keywords :
biothermics; blood flow measurement; microwave heating; patient treatment; SAR; biological heat equation; biological tissue; blood vessels; circularly polarized microstrip patch antenna; dielectric properties; electromagnetic energy; heating pattern; human body thermoregulation; hybrid microwave-optical device; integrated optical system; localized deep heating; specific absorption rate; superficial heat reduction technique; thermal distribution; thermal properties; tissue oxygenation; Applicators; Electromagnetic heating; Microwave theory and techniques; Muscles; Skin; Specific absorption rate;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
DOI :
10.1109/EMBC.2013.6610359