DocumentCode :
636787
Title :
Multi-level 3D implementation of thermo-pneumatic pumping on centrifugal microfluidic CD platforms
Author :
Thio, Tzer Hwai Gilbert ; Ibrahim, Fatimah ; Al-Faqheri, Wisam ; Soin, Norhayati ; Bador Abdul Kahar, Maria Kahar ; Madou, Marc
Author_Institution :
Dept. of Biomed. Eng., Univ. of Malaya, Kuala Lumpur, Malaysia
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
5513
Lastpage :
5516
Abstract :
Thermo-pneumatic (TP) pumping is a method employing the principle of expanding heated air to transfer fluids back towards the CD center on the centrifugal microfluidic CD platform. While the TP features are easy to fabricate as no moving parts are involved, it consumes extra real estate on the CD, and because heating is involved, it introduces unnecessary heating to the fluids on the CD. To overcome these limitations, we introduce a multi-level 3D approach and implement forced convection heating. In a multi-level 3D CD, the TP features are relocated to a separate top level, while the microfluidic process remains on a lower bottom level. This allows for heat shielding of the fluids in the microfluidic process level, and also improve usage of space on the CD. To aid in future implementations of TP pumping on a multi-level 3D CD, studies on the effect of heat source setting, and the effect of positioning the TP feature (it distance from the CD center) on CD surface heating are also presented. In this work, we successfully demonstrate a multi-level 3D approach to implement TP pumping on the microfluidic CD platform.
Keywords :
microfluidics; micropumps; patient diagnosis; pneumatic systems; CD center; CD surface heating; centrifugal microfluidic CD platforms; compact disc; forced convection heating; heat shielding; microfluidic process; multilevel 3D CD; thermopneumatic pumping; Heat pumps; Liquids; Microfluidics; Space heating; Temperature measurement; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6610798
Filename :
6610798
Link To Document :
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