DocumentCode :
636943
Title :
Non-planar and flexible chip technology for biomedical applications
Author :
Ching-Yu Liu ; Hsiao-Chen Lin ; Chih-Chiao Teng ; Long-Sheng Fan
Author_Institution :
Inst. of NanoEngineering & Microsyst., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
6825
Lastpage :
6829
Abstract :
We report a novel non-planar flexible silicon chip technology by means of patterning thin films of high residual stress on top of shaped thin silicon substrate. High residual stresses of thin films make thin chip deform into designed three-dimensional shapes. In this study, a series of patterned stress films and “petal-like” chips were fabricated and analyzed. Large curvatures can also be formed and maintained by the packaging process bonding the chips to constraining elements such as thin-film polymer ring structures. As a demonstration, a CMOS image-sensing retina chip is made into a contact-lens shape conforming to a human eyeball 12.5mm in radius. This non-planar and flexible chip technology provides a desirable device surface interface to soft or non-planar bio surfaces and opens up possibilities for many biomedical applications.
Keywords :
CMOS image sensors; biomedical electronics; biomedical equipment; biomedical imaging; biomedical materials; biomimetics; flexible electronics; internal stresses; materials preparation; polymers; silicon; substrates; thin films; CMOS image-sensing retina chip; Si; biomedical application; chip bonding; contact-lens shape; device surface interface; human eyeball radius; large curvature; nonplanar flexible chip technology; packaging process; patterned stress film fabrication; petal-like chip fabrication; size 12.5 mm; soft nonplanar biosurface; thin chip deformation; thin film high residual stress; thin film patterning; thin silicon substrate; thin-film polymer ring structure; three-dimensional shape design; CMOS integrated circuits; Films; Retina; Shape; Silicon; Stress; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6611125
Filename :
6611125
Link To Document :
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