• DocumentCode
    636987
  • Title

    Local dynamic stability of lower extremity joints in lower limb amputees during slope walking

  • Author

    Jin-ling Chen ; Dong-Yun Gu

  • Author_Institution
    Biomed. Eng. Sch., Shanghai Jiaotong Univ., Shanghai, China
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    7241
  • Lastpage
    7244
  • Abstract
    Lower limb amputees have a higher fall risk during slope walking compared with non-amputees. However, studies on amputees´ slope walking were not well addressed. The aim of this study was to identify the difference of slope walking between amputees and non-amputees. Lyapunov exponents λS was used to estimate the local dynamic stability of 7 transtibial amputees´ and 7 controls´ lower extremity joint kinematics during uphill and downhill walking. Compared with the controls, amputees exhibited significantly lower λS in hip (P=0.04) and ankle (P=0.01) joints of the sound limb, and hip joints (P=0.01) of the prosthetic limb during uphill walking, while they exhibited significantly lower λS in knee (P=0.02) and ankle (P=0.03) joints of the sound limb, and hip joints (P=0.03) of the prosthetic limb during downhill walking. Compared with amputees level walking, they exhibited significantly lower λS in ankle joints of the sound limb during both uphill (P=0.01) and downhill walking (P=0.01). We hypothesized that the better local dynamic stability of amputees was caused by compensation strategy during slope walking.
  • Keywords
    Lyapunov methods; bone; gait analysis; kinematics; medical control systems; prosthetics; stability; Lyapunov exponents; ankle joints; downhill walking; hip joints; knee joints; local dynamic stability; lower extremity joint kinematics; lower limb amputees; prosthetic limb; slope walking; transtibial amputees; uphill walking; Erbium; Hip; Joints; Knee; Legged locomotion; Prosthetic limbs; Stability analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6611229
  • Filename
    6611229