DocumentCode :
637009
Title :
The influences of emotional intensity for happiness and sadness on walking
Author :
Destephe, M. ; Maruyama, Tetsuhiro ; Zecca, M. ; Hashimoto, Koji ; Takanishi, A.
Author_Institution :
Grad. Sch. of Sci. & Eng., Waseda Univ., Tokyo, Japan
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
7452
Lastpage :
7455
Abstract :
Walking is one of the most common activities that we perform every day. Even if the main goal of walking is to move from one place to another place, walking can also convey emotional clues in social context. Those clues can be used to improve interactions or any messages we want to express. However, there are not many studies on the effects of the intensity of the emotions on the walking. In this paper, the authors propose to assess the differences between the expression of emotion regarding the expressed intensity (low, middle, high and exaggerated). We observed two professional actors perform emotive walking, with different intensities and we analyzed the recorded data. For each emotion, we analyzed characteristic features which can be used in the future to model gait patterns and to recognize emotions from the gait parameters. Additionally, we found characteristics which can be used to create new emotion expression for our biped robot Kobian, improving the human-robot interaction.
Keywords :
emotion recognition; feature extraction; gait analysis; mobile robots; psychology; biped robot Kobian; characteristic feature analysis; data analysis; emotion expression; emotion recognition; emotional clue; emotional intensity effect; emotive walking; exaggerated intensity; expressed intensity; gait parameter; gait pattern model; happiness; high intensity; human-robot interaction; low intensity; middle intensity; professional actor; sadness; Context; Educational institutions; Emotion recognition; Foot; Human-robot interaction; Legged locomotion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6611281
Filename :
6611281
Link To Document :
بازگشت