Title :
Table of contents
Abstract :
The following topics are dealt with: Compact Modeling for More than Moore; xTCA for Instrumentation; Design of Integrated Circuits and Microsystems; Thermal Issues in Microelectronics; Analysis and Modelling of ICs and Microsystems; Microelectronics Technology and Packaging; Testing and Reliability; Power Electronics; Signal Processing; Embedded Systems; and Medical Applications.
Keywords :
electronics packaging; embedded systems; integrated circuit design; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; micromechanical devices; power electronics; signal processing; IC analysis; IC modelling; compact modeling; embedded systems; instrumentation; integrated circuits design; medical applications; microelectronics packaging; microelectronics technology; microsystems; power electronics; reliability; signal processing; testing; thermal issues; xTCA;
Conference_Titel :
Mixed Design of Integrated Circuits and Systems (MIXDES), 2013 Proceedings of the 20th International Conference
Conference_Location :
Gdynia
Print_ISBN :
978-83-63578-00-8
