Title :
A flip-flop implementation for the DPA-resistant Delay-based Dual-rail Pre-charge Logic family
Author :
Bongiovanni, Simone ; Olivieri, Mauro ; Scotti, Gianmario ; Trifiletti, A.
Author_Institution :
DIET, Univ. degli Studi di Roma “La Sapienza”, Rome, Italy
Abstract :
Delay-based Dual-rail Pre-charge Logic (DDPL) is a logic style introduced with the aim of hiding power consumption in cryptographic circuits when a Power Analysis (PA) attack is mounted. Its particular data encoding allows to make the adsorbed current constant for each data input combination, irrespective of capacitive load conditions. The purpose is breaking the link between dynamic power and data statistics and preventing power analysis. In this work we present a novel implementation of a dynamic differential master-slave flip-flop which is compatible with the DDPL data encoding. Efforts were made in order to design a fully dynamic master-slave architecture which does not require a conversion of the signals from dynamic to static domain. Moreover it will be shown that the area occupied is also reduced due to a compact differential layout. Simulations performed using a 65nm-CMOS process showed that the proposed circuit exhibits good performances in terms of average power and NED (Normalized Energy Deviation) as required in transistor level countermeasures against power analysis, and it outperforms other previously published DPA-resistant flip-flops in the real case of unbalanced load conditions.
Keywords :
CMOS logic circuits; delays; encoding; flip-flops; CMOS; DPA-resistant delay-based dual-rail pre-charge logic family; cryptographic circuits; data encoding; dynamic differential master-slave flip-flop; flip-flop implementation; normalized energy deviation; power analysis; size 65 nm; Clocks; Flip-flops; Inverters; Latches; Logic gates; Master-slave; Power demand; Cryptography; VLSI design; delay-based dual-rail pre-charge logic (DDPL); dual-rail logic; dynamic flip-flop; power analysis (PA); sense amplifier-based logic (SABL);
Conference_Titel :
Mixed Design of Integrated Circuits and Systems (MIXDES), 2013 Proceedings of the 20th International Conference
Conference_Location :
Gdynia
Print_ISBN :
978-83-63578-00-8