DocumentCode
637666
Title
Influence of Scaling on IC Temperature in FinFET Microprocessor Technologies
Author
Janicki, Marcin ; Zajac, Piotr ; Szermer, Michal ; Napieralski, A.
Author_Institution
Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland
fYear
2013
fDate
20-22 June 2013
Firstpage
312
Lastpage
315
Abstract
This paper analyses the influence of technology migration on temperature of integrated circuit manufactured in FinFET technologies. The problem is discussed based on the results of thermal simulations obtained for two microprocessors manufactured in different technologies.
Keywords
MOSFET circuits; integrated circuit design; microprocessor chips; scaling circuits; FinFET technologies; IC temperature; microprocessor technologies; scaling; thermal simulations; Bridge circuits; Bridges; Density measurement; Integrated circuit modeling; Power dissipation; Power system measurements; Program processors; Many-core architectures; technology migration; thermal simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed Design of Integrated Circuits and Systems (MIXDES), 2013 Proceedings of the 20th International Conference
Conference_Location
Gdynia
Print_ISBN
978-83-63578-00-8
Type
conf
Filename
6613364
Link To Document