Title :
Table of contents
Abstract :
The following topics are dealt with: interconnect technology; reliability; packaging; 3D integration; electromigration; novel materials and process integration.
Keywords :
electromigration; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; three-dimensional integrated circuits; 3D integration; electromigration; interconnect technology; novel materials; packaging; process integration; reliability;
Conference_Titel :
Interconnect Technology Conference (IITC), 2013 IEEE International
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-0438-9
DOI :
10.1109/IITC.2013.6615547
