• DocumentCode
    638804
  • Title

    Dynamic modeling and analysis of A 3-DOF parallel haptic device

  • Author

    YiLi Fu ; Yang Yang ; Bo Pan ; Shuguo Wang

  • Author_Institution
    State Key Lab. of Robot. & Syst., Harbin Inst. of Technol., Harbin, China
  • fYear
    2013
  • fDate
    4-7 Aug. 2013
  • Firstpage
    110
  • Lastpage
    115
  • Abstract
    This paper has developed a three degree-of-freedom (3-DOF) haptic device which has adopted parallel structure. Compared with haptic devices adopting serial structure, parallel haptic devices have low inertia, high stiffness and can transfer large force or torque. Although parallel mechanism possess advantages above mentioned and other benefits, the presence of its closed-loop structure and redundant joints make it difficult to develop a dynamic model, which is essential in creating a model-based control strategy for the device. To establish a simple dynamic model that can be easily calculated in real time, the virtual work principle is used. After derivation of the kinematic and dynamic equations, simulation using ADAMS is conducted to verify the validity of dynamic model. Given that it is highly efficient and correct, the dynamic modeling can be used for real-time force feedback control.
  • Keywords
    closed loop systems; feedback; force control; haptic interfaces; redundant manipulators; robot dynamics; robot kinematics; 3-DOF parallel haptic device; ADAMS; closed-loop structure; dynamic equation; dynamic modeling; kinematic equation; model-based control strategy; parallel structure; real-time force feedback control; redundant joints; stiffness; virtual work principle; Dynamics; Equations; Force; Haptic interfaces; Joints; Kinematics; Mathematical model; dynamic modeling; haptic device; kinematic analysis; parallel mechanism;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation (ICMA), 2013 IEEE International Conference on
  • Conference_Location
    Takamatsu
  • Print_ISBN
    978-1-4673-5557-5
  • Type

    conf

  • DOI
    10.1109/ICMA.2013.6617902
  • Filename
    6617902