Title :
A hybrid MAC layer for localization and data communication in ultra wide band based wireless sensor networks
Author :
Janssen, Marijn ; Busboom, Andreas ; Schoon, Udo ; Koch, Christian ; von Colln, Gerd
Author_Institution :
Hochschule Emden/Leer, Dept. of Inf. & Electron., Univ. of Appl. Sci., Emden, Germany
Abstract :
This paper presents a hybrid MAC layer design for UWB based sensor networks to handle multiple access with the ability to combine localization and data communication. UWB networks allow high precision ranging and robust data communication in harsh environmental conditions and for this are well suited for typical automation applications. To minimize localization errors in this applications, e. g. by moving sensor nodes, rangings have strong realtime requirements and must be done in a distinct pre-defined order. This can not be guaranteed in common MAC layer implementations, which are typically based on the IEEE 802.15.3 standard with contention access (CSMA/CA) and contention free access part (TDMA). The MAC scheme proposed in this paper overcomes this limitations as the contention access part is replaced by a TDMA/CDMA scheme. Evaluation results presented in this paper show that this novel approach outperforms existing schemes and fulfils the requirement for realtime ranging and communication.
Keywords :
IEEE standards; carrier sense multiple access; code division multiple access; time division multiple access; ultra wideband communication; wireless sensor networks; CSMA-CA; IEEE 802.15.3 standard; TDMA-CDMA; UWB network; automation application; carrier sense multiple access; code division multiple access; contention free access part; data communication; hybrid MAC layer protocol design; localization error minimization; multiple access handling; time division multiple access; ultrawideband based wireless sensor network; Distance measurement; IEEE 802.15 Standards; Media Access Protocol; Peer-to-peer computing; Time division multiple access;
Conference_Titel :
Industrial Informatics (INDIN), 2013 11th IEEE International Conference on
Conference_Location :
Bochum
DOI :
10.1109/INDIN.2013.6622931