Title :
Table of contents
Abstract :
The following topics are dealt with: microelectronics; nanoelectronics; packaging; automotive electronics; sensors; integrated circuits; design and processing.
Keywords :
automotive electronics; bonding processes; design engineering; electronics packaging; integrated circuits; nanoelectronics; sensors; automotive electronics; design; integrated circuits; microelectronics; nanoelectronics; packaging; processing; sensors;
Conference_Titel :
Electronics Technology (ISSE), 2013 36th International Spring Seminar on
Conference_Location :
Alba Iulia
DOI :
10.1109/ISSE.2013.6648290