• DocumentCode
    643575
  • Title

    Dielectric waveguide with planar multi-mode excitation for high data-rate chip-to-chip interconnects

  • Author

    Dolatsha, Nemat ; Arbabian, Amin

  • Author_Institution
    EE Dept., Univ. & ETH Zurich, Zurich, Switzerland
  • fYear
    2013
  • fDate
    15-18 Sept. 2013
  • Firstpage
    184
  • Lastpage
    188
  • Abstract
    An all-electrical, low-cost, wideband chip-to-chip link on a multi-mode dielectric waveguide is proposed. The signal is coupled from the silicon chip to the fundamental and polarization-orthogonal degenerate Ex11 and Ey11 waveguide modes using planar electric and slot dipole antennas, respectively. This approach doubles the capacity of a single line without sacrificing robustness or adding implementation cost and complexity. Two independent ultra-wideband 30GHz channels, each from 90 GHz to 120 GHz, are demonstrated. The large available bandwidth will be channelized in frequency for optimal overall efficiency with a CMOS transceiver. Various design aspects of the structure are examined and discussed. The proposed waveguide offers a solution for Terabit-per-second (Tbps) electrical wireline links.
  • Keywords
    CMOS integrated circuits; dielectric waveguides; dipole antennas; integrated circuit interconnections; planar antennas; radio transceivers; CMOS transceiver; dielectric waveguide; frequency 90 GHz to 120 GHz; high data-rate chip-to-chip interconnects; multimode dielectric waveguide; planar electric antennas; planar multimode excitation; polarization-orthogonal degenerate Ex11 waveguide modes; polarization-orthogonal degenerate Ey11 waveguide modes; silicon chip; slot dipole antennas; terabit-per-second electrical wireline links; Bandwidth; Couplings; Dielectrics; Dipole antennas; Optical waveguides; Permittivity; Strips; Serial link; chip-to-chip interconnects; dielectric waveguide; mm-Wave interconnects; multi mode propagation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultra-Wideband (ICUWB), 2013 IEEE International Conference on
  • Conference_Location
    Sydney, NSW
  • ISSN
    2162-6588
  • Type

    conf

  • DOI
    10.1109/ICUWB.2013.6663845
  • Filename
    6663845