Title :
5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED
Author :
Vairavan, Rajendaran ; Sauli, Zaliman ; Retnasamy, Vithyacharan ; Ehkan, P. ; Ong Tee Say
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia
Abstract :
Light-emitting diodes (LEDs), have materialized as an innovative light source which features energy saving properties, good optical performance and efficacy which is added advantage over orthodox lighting systems. However, the efficacy of the LED is influenced by heat generated at the junction of the LED. Hence, in this study, the thermal and stress analysis of single chip LED package with copper diamond heat slug with dimension of 5mm x 5mm x 1mm was carried out through simulation under natural convection condition. Input power of 0.1W and 1W were applied to the single chip LED model. Result of the simulation indicates that at input power 1W, junction temperature of 107.02 °C and stress of 104.59 MPa were obtained.
Keywords :
composite materials; copper; diamond; electronics packaging; light emitting diodes; stress effects; thermal analysis; Cu-C; copper-diamond composite slug stress evaluation; copper-diamond heat slug; light-emitting diodes; natural convection condition; power 0.1 W; power 1 W; single chip LED package; temperature 107.02 degC; thermal analysis; Analytical models; Heat sinks; Heating; Junctions; Light emitting diodes; Stress; Thermal analysis; ansys; copper diamond slug; junction temperature; single chip LED; thermal analysis;
Conference_Titel :
Modelling Symposium (AMS), 2013 7th Asia
Conference_Location :
Hong Kong
DOI :
10.1109/AMS.2013.17
