5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED

Author

Vairavan, Rajendaran ; Sauli, Zaliman ; Retnasamy, Vithyacharan ; Ehkan, P. ; Ong Tee Say

Author_Institution

Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia

fYear

2013

fDate

23-25 July 2013

Firstpage

78

Lastpage

81

Abstract

Light-emitting diodes (LEDs), have materialized as an innovative light source which features energy saving properties, good optical performance and efficacy which is added advantage over orthodox lighting systems. However, the efficacy of the LED is influenced by heat generated at the junction of the LED. Hence, in this study, the thermal and stress analysis of single chip LED package with copper diamond heat slug with dimension of 5mm x 5mm x 1mm was carried out through simulation under natural convection condition. Input power of 0.1W and 1W were applied to the single chip LED model. Result of the simulation indicates that at input power 1W, junction temperature of 107.02 °C and stress of 104.59 MPa were obtained.

Keywords

composite materials; copper; diamond; electronics packaging; light emitting diodes; stress effects; thermal analysis; Cu-C; copper-diamond composite slug stress evaluation; copper-diamond heat slug; light-emitting diodes; natural convection condition; power 0.1 W; power 1 W; single chip LED package; temperature 107.02 degC; thermal analysis; Analytical models; Heat sinks; Heating; Junctions; Light emitting diodes; Stress; Thermal analysis; ansys; copper diamond slug; junction temperature; single chip LED; thermal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Modelling Symposium (AMS), 2013 7th Asia

Conference_Location

Hong Kong

Type

conf

DOI

10.1109/AMS.2013.17

Filename

6664672