DocumentCode
646612
Title
PAKCK: Performance and power analysis of key computational kernels on CPUs and GPUs
Author
Mullen, Julia S. ; Wolf, Michael M. ; Klein, Andreas
Author_Institution
MIT Lincoln Lab., Lexington, MA, USA
fYear
2013
fDate
10-12 Sept. 2013
Firstpage
1
Lastpage
6
Abstract
Recent projections suggest that applications and architectures will need to attain 75 GFLOPS/W in order to support future DoD missions. Meeting this goal requires deeper understanding of kernel and application performance as a function of power and architecture. As part of the PAKCK study, a set of DoD application areas, including signal and image processing and big data/graph computation, were surveyed to identify performance critical kernels relevant to DoD missions. From that survey, we present the characterization of dense matrix-vector product, two dimensional FFTs, and sparse matrix-dense vector multiplication on the NVIDIA Fermi and Intel Sandy Bridge architectures. We describe the methodology that was developed for characterizing power usage and performance on these architectures and present power usage and performance per Watt for all three kernels. Our results indicate that 75 GFLOPS/W is a very challenging target for these kernels, especially for the sparse kernels, whose performance was orders of magnitude lower than dense kernels.
Keywords
fast Fourier transforms; graphics processing units; matrix multiplication; power aware computing; vectors; CPUs; DoD missions; GFLOPS/W; GPUs; Intel Sandy Bridge architectures; NVIDIA Fermi archtecture; PAKCK; and sparse matrixdense vector multiplication; big data; dense matrix-vector product; graph computation; image processing; key computational kernels; performance critical kernel idnetification; performance per Watt; signal processing; sparse kernels; two dimensional FFTs; Bridges; Computer architecture; Graphics processing units; Kernel; Libraries; Sparse matrices;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Extreme Computing Conference (HPEC), 2013 IEEE
Conference_Location
Waltham, MA
Print_ISBN
978-1-4799-1364-0
Type
conf
DOI
10.1109/HPEC.2013.6670319
Filename
6670319
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