DocumentCode
646657
Title
Experimental validation of an 8 GHz EBG based common mode filter and impact of manufacturing uncertainties
Author
de Paulis, Francesco ; Nisanci, M.H. ; Orlandi, Antonio ; Xiaoxiong Gu ; Rimolo-Donadio, Renato ; Baks, Christian ; Young Kwark ; Archambeault, Bruce ; Connor, Samuel
Author_Institution
UAq EMC Lab., Univ. of L´Aquila, L´Aquila, Italy
fYear
2013
fDate
5-9 Aug. 2013
Firstpage
27
Lastpage
32
Abstract
Common mode noise associated to the differential signal propagation represents a major concern for crosstalk and EMI issues. The common mode filter based on electromagnetic band-gap (EBG) structures have been shown to be cost effective and easy to design, since they are made using the standard PCB technology. The coupling between the differential interconnect and the EBG cavity converts the energy associated to the common mode into the cavity resonant mode, thus reducing the common mode noise reaching the receiver. A simple design procedure is reviewed in this paper for a quick design, and it is applied to a 8 GHz filter. The filter is then manufactured on a 6 layer PCB and its performances are investigated through measurements both in frequency and time domain. The filter topology as well as the design procedure are validated through model-to-hardware correlation..
Keywords
cavity resonator filters; crosstalk; electromagnetic coupling; electromagnetic interference; interference suppression; network topology; photonic band gap; printed circuit design; radio receivers; time-frequency analysis; EBG cavity; EBG structure; EMI; cavity resonant mode; common mode filter; common mode noise reduction; crosstalk; design procedure; differential interconnect; differential signal propagation; electromagnetic bandgap; electromagnetic coupling; energy conversion; filter topology; frequency 8 GHz; frequency domain analysis; manufacturing uncertainty impact; model-to-hardware correlation; receiver; standard PCB technology; time domain analysis; Bandwidth; Cavity resonators; Integrated circuit modeling; Metamaterials; Periodic structures; Resonant frequency; Solids;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
Conference_Location
Denver, CO
ISSN
2158-110X
Print_ISBN
978-1-4799-0408-2
Type
conf
DOI
10.1109/ISEMC.2013.6670376
Filename
6670376
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