• DocumentCode
    646683
  • Title

    Shielding effectiveness evaluation of a loaded perforated enclosure by hybrid FDFD-MoM

  • Author

    Azadifar, Mohammad ; Dehkhoda, P. ; Sadeghi, S.H.H. ; Moini, R.

  • Author_Institution
    Electr. Eng., AmirKabir Univ. of Technol., Tehran, Iran
  • fYear
    2013
  • fDate
    5-9 Aug. 2013
  • Firstpage
    167
  • Lastpage
    170
  • Abstract
    In this Paper, shielding effectiveness of an enclosure is analyzed by an efficient hybrid finite difference frequency domain (FDFD) and method of Moments (MoM) technique. The enclosure is loaded with a realistic microstrip transmission line (MTL). The susceptibility of the load is also studied to show the effect of external interference plane wave. In our proposed FDFD solution, lumped elements are modelled by modifying the representing node coefficient according to the type and direction of the element. Also, non uniform discretization is applied for the FDFD solution region to increase the analysis efficiency. In addition, here, the frequency-independent elements of the impedance matrix are identified and are computed once and then are used for the whole frequency range. Results are validated by commercial software simulations.
  • Keywords
    electromagnetic shielding; electromagnetic wave interference; finite difference methods; frequency-domain analysis; impedance matrix; method of moments; microstrip lines; transmission lines; MTL; external interference plane wave; frequency-independent elements; hybrid FDFD-MoM; hybrid finite difference frequency domain; impedance matrix; load susceptibility; loaded perforated enclosure; lumped elements; method of moments; microstrip transmission line; node coefficient; nonuniform discretization; shielding effectiveness evaluation; Apertures; Electric fields; Electromagnetic compatibility; Finite difference methods; Finite element analysis; Load modeling; Method of moments;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
  • Conference_Location
    Denver, CO
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4799-0408-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2013.6670402
  • Filename
    6670402