DocumentCode
646744
Title
Co-simulation of distributive and lumped systems using the discontinuous Galerkin time domain finite element method
Author
Ping Li ; Li Jun Jiang
Author_Institution
Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China
fYear
2013
fDate
5-9 Aug. 2013
Firstpage
494
Lastpage
498
Abstract
The signal integrity and power integrity analysis of 3D integrated circuits or other EMC/EMI systems usually separate the lumped circuit modeling and the distributive system modeling. However, due to the high density of integration, it is not proper to separate them in the modeling process anymore. In this paper, a hybrid electromagnetics (EM)-circuit simulator is proposed for incorporating multiport lumped circuit networks through their admittance matrices into the discontinuous Galerkin time-domain finite element method (DGTDFEM). The admittance matrix in the Laplace-domain can be derived analytically or obtained from network parameters such as S-parameters in the frequency domain. To convert frequency dependent S-parameters into the admittance matrix in the Laplace-domain, the vector fitting technique is employed to facilitate the mapping process. The computational domain of interest is split into two subdomains. One is the EM-part solved by the DGTDFEM, another is the circuit-part modeled by the basic I - V relationships in the time domain. The proposed method is valid for both linear and non-linear lumped components. And it is useful for subsystems with either measured data or equivalent circuit models. Benchmarks are provided to demonstrate the validity of the proposed method.
Keywords
Galerkin method; Laplace equations; S-parameters; circuit simulation; electromagnetic compatibility; electromagnetic interference; equivalent circuits; finite element analysis; frequency-domain analysis; integrated circuit modelling; time-domain analysis; 3D integrated circuits; DGTDFEM; EM-circuit simulator; EMC/EMI systems; Laplace-domain; admittance matrix; cosimulation; discontinuous Galerkin time-domain finite element method; distributive system modeling; equivalent circuit models; frequency dependent S-parameters; frequency domain; hybrid electromagnetics circuit simulator; lumped circuit modeling; mapping process; multiport lumped circuit networks; network parameters; nonlinear lumped components; power integrity analysis; signal integrity; vector fitting technique; Admittance; Integrated circuit modeling; Mathematical model; Method of moments; Ports (Computers); Time-domain analysis; Vectors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
Conference_Location
Denver, CO
ISSN
2158-110X
Print_ISBN
978-1-4799-0408-2
Type
conf
DOI
10.1109/ISEMC.2013.6670463
Filename
6670463
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