DocumentCode :
646749
Title :
Modelling of wireless electromagnetic environment effects in multi-interconnected metallic cabins using the leapfrog ADI-FDTD method
Author :
Meng-Lin Zhai ; Wen-Yan Yin ; Zhizhang Chen
Author_Institution :
Key Lab. of Minist. of Educ. of Design & EMC of High-Speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China
fYear :
2013
fDate :
5-9 Aug. 2013
Firstpage :
518
Lastpage :
521
Abstract :
Wireless technologies continue to be an active area of research. Thus it is important to predict multipath effects of complex channel environments precisely. Although experimental approaches are reliable and close to reality, they can be very expensive due to the requirement for special equipment and setup; and in many cases, it is inconvenient or impossible to preset testing environments. Thus, in this paper, a rigorous fullwave numerical solution, via the leapfrog alternating direction implicit finite difference time domain (Leapfrog ADI-FDTD) method for lossy media, is applied to characterize the channel of multi-interconnected metallic cabins. By comparing the simulation results with the conventional FDTD, the proposed method demonstrates both good simulation efficiency and high accuracy. Electromagnetic effects on a human body in the multi-interconnected metallic cabins are also simulated. Various propagation characteristics are captured such as the power-delay time constant that describes the multipath time delay effect.
Keywords :
computational electromagnetics; electromagnetic wave propagation; finite difference time-domain analysis; ships; finite difference time domain; fullwave numerical solution; leapfrog ADI-FDTD method; multiinterconnected metallic cabins; multipath time delay effect; power-delay time constant; propagation channel; simulation efficiency; wireless electromagnetic environment effects; Biological system modeling; Computational modeling; Finite difference methods; Simulation; Time-domain analysis; Wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
Conference_Location :
Denver, CO
ISSN :
2158-110X
Print_ISBN :
978-1-4799-0408-2
Type :
conf
DOI :
10.1109/ISEMC.2013.6670468
Filename :
6670468
Link To Document :
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