DocumentCode :
646765
Title :
Comparison of conducted disturbance voltages at telecommunication ports measured using different reference ground planes in accordance with CISPR 32
Author :
Akiyama, Yoko ; Aotani, Yoshihisa ; Okada, Kenichi ; Muramatsu, Hidenori
Author_Institution :
NTT Energy & Environ. Syst. Labs., Musashino, Japan
fYear :
2013
fDate :
5-9 Aug. 2013
Firstpage :
611
Lastpage :
615
Abstract :
To prevent radio interference due to the electromagnetic field generated by conducted disturbances at the telecommunication ports of information technology equipment, the disturbances are measured using test arrangements in accordance with standards published by the International Special Committee on Radio Interference (CISPR). We compared the conducted disturbance voltages at the telecommunication ports of two laptop PCs and one desktop PC measured using three test arrangements specified in CISPR 32. Whether the reference ground plane is vertical or horizontal is a major difference in the three test arrangements. As a result, the differences between the voltages of the laptop PCs measured using the three test arrangements were smaller than 2 dB. The differences between the voltages of the desktop PC measured using these test arrangements were about 3 dB at a few frequencies. The standard measurement instrumentation uncertainty for conducted disturbance measurement determined in the CISPR standard is 4.59 dB. Hence, the differences in voltages measured using the three test arrangements were not significant.
Keywords :
radio equipment; radiofrequency interference; voltage measurement; CISPR standard; International Special Committee on Radio Interference; disturbance measurement; disturbance voltage conduction; electromagnetic field generation; information technology equipment; laptop PC; reference ground plane; telecommunication port; telecommunication port measurement; Communication cables; Communications technology; Measurement uncertainty; Portable computers; Ports (Computers); Uncertainty; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
Conference_Location :
Denver, CO
ISSN :
2158-110X
Print_ISBN :
978-1-4799-0408-2
Type :
conf
DOI :
10.1109/ISEMC.2013.6670484
Filename :
6670484
Link To Document :
بازگشت