DocumentCode :
646772
Title :
Sheet absorbing material modeling and application for enclosures
Author :
Radchenko, Andriy ; Bishop, J. ; Johnson, R. ; Dixon, Paul ; Koledintseva, Marina ; Jobava, R. ; Pommerenke, David ; Drewniak, James
Author_Institution :
EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
fYear :
2013
fDate :
5-9 Aug. 2013
Firstpage :
645
Lastpage :
650
Abstract :
This paper demonstrates relevant physics and provides recommendations regarding thin sheet absorber material applications in enclosures of electronic circuitry. Sheet absorbers placed on the walls of an enclosure are studied herein both experimentally and through the full-wave numerical simulations. In practical applications, the applied absorbing patches need to be selected in terms of proper material type, thickness, size, and placement within an enclosure. The goal is to achieve the maximum effectiveness to suppress electromagnetic field at problem resonances in the enclosure.
Keywords :
absorbing media; electromagnetic fields; electromagnetic wave interference; electromagnetic wave propagation; electromagnetic field; electronic circuitry; enclosures; thin sheet absorber material applications; Cavity resonators; Frequency measurement; Load modeling; Materials; Numerical models; Resonant frequency; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
Conference_Location :
Denver, CO
ISSN :
2158-110X
Print_ISBN :
978-1-4799-0408-2
Type :
conf
DOI :
10.1109/ISEMC.2013.6670491
Filename :
6670491
Link To Document :
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