• DocumentCode
    646772
  • Title

    Sheet absorbing material modeling and application for enclosures

  • Author

    Radchenko, Andriy ; Bishop, J. ; Johnson, R. ; Dixon, Paul ; Koledintseva, Marina ; Jobava, R. ; Pommerenke, David ; Drewniak, James

  • Author_Institution
    EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
  • fYear
    2013
  • fDate
    5-9 Aug. 2013
  • Firstpage
    645
  • Lastpage
    650
  • Abstract
    This paper demonstrates relevant physics and provides recommendations regarding thin sheet absorber material applications in enclosures of electronic circuitry. Sheet absorbers placed on the walls of an enclosure are studied herein both experimentally and through the full-wave numerical simulations. In practical applications, the applied absorbing patches need to be selected in terms of proper material type, thickness, size, and placement within an enclosure. The goal is to achieve the maximum effectiveness to suppress electromagnetic field at problem resonances in the enclosure.
  • Keywords
    absorbing media; electromagnetic fields; electromagnetic wave interference; electromagnetic wave propagation; electromagnetic field; electronic circuitry; enclosures; thin sheet absorber material applications; Cavity resonators; Frequency measurement; Load modeling; Materials; Numerical models; Resonant frequency; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
  • Conference_Location
    Denver, CO
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4799-0408-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2013.6670491
  • Filename
    6670491