DocumentCode :
646774
Title :
In-band spurious attenuation in LTE-class RFIC chip using a soft magnetic thin film
Author :
Muroga, Sho ; Endo, Yuta ; Ito, Takao ; Tanaka, Shoji ; Murakami, M. ; Hori, Kenji ; Takahashi, Satoshi ; Naoya, Azuma ; Makita, Tetsuya ; Imai, Suguru ; Nagata, M. ; Yamaguchi, Masaki
Author_Institution :
Grad. Sch. of Eng., Tohoku Univ., Sendai, Japan
fYear :
2013
fDate :
5-9 Aug. 2013
Firstpage :
657
Lastpage :
661
Abstract :
A long term evolution (LTE)-class CMOS radio frequency integrated circuit (RFIC) receiver test element group (TEG) chip is developed in our project for the next generation cell phone handsets in order to clarify the on-chip-level noise coupling and demonstrate the noise attenuation using the soft magnetic thin film as an on-chip electromagnetic noise suppressor. The TEG chip equips a noise generator and a RF receiver block. The RF block amplifies and demodulates transmitted signals to IQ signals. A Co85Zr3Nb12 soft magnetic thin film is integrated onto the TEG chip as a noise suppressor. In this report, the noise generator is driven by a clock signal of 124.803 MHz and generates 17th harmonics of 2,165 MHz conflicts with the LTE band 1 (2,110 - 2,170 MHz). As a result, the in-band digital noise was suppressed 5-20 dB by the Co-Zr-Nb thin film as an integrated noise suppressor.
Keywords :
CMOS integrated circuits; Long Term Evolution; UHF integrated circuits; VHF circuits; cellular radio; cobalt alloys; coupled circuits; demodulation; electromagnetic coupling; integrated circuit noise; integrated circuit testing; magnetic thin film devices; magnetic thin films; mobile handsets; niobium alloys; noise abatement; noise generators; radio receivers; soft magnetic materials; zirconium alloys; 17th harmonics generation; CMOS radiofrequency integrated circuit receiver; Co85Zr3Nb12; IQ signal; LTE-class RFIC chip; Long Term Evolution; Soft Magnetic Thin Film; TEG chip; frequency 124.803 MHz; frequency 2110 MHz to 2170 MHz; frequency 2165 MHz; in-band spurious noise attenuation; next generation cell phone handset; noise figure 5 dB to 20 dB; noise generator; on-chip-level electromagnetic noise coupling suppressor; test element group chip; transmitted signal amplifier; transmitted signal demodulation; CMOS integrated circuits; Couplings; Magnetic films; Noise; Permeability; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
Conference_Location :
Denver, CO
ISSN :
2158-110X
Print_ISBN :
978-1-4799-0408-2
Type :
conf
DOI :
10.1109/ISEMC.2013.6670493
Filename :
6670493
Link To Document :
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