Title :
Automotive EMC analysis using the hybrid finite element boundary integral approach
Author :
Mologni, J.F. ; Kopp, M. ; Siqueira, C.L.R. ; Colin, Antoine ; Nogueira, Antonio ; Alves, M.A.R.
Author_Institution :
Electron. Design Autom. Dept., ESSS/ANSYS, Sao Paulo, Brazil
Abstract :
The majority of innovative trends in automotive industry today relies on electronic systems. Understanding the electromagnetic behavior of the electronic control units (ECUs) in a vehicle has become an ever increasing concern of automotive manufacturers. Computational Electromagnetic Modeling (CEM) is a cost effective approach that has being adopted by the automotive industry to address electromagnetic compatibility (EMC) problems. Automotive structures are electrically large in nature and the systems required for a complete EMC analysis can be fairly complex. For this reason, there is no single numerical technique that can be used to address all automotive EMC problems. This paper shows how the automotive standard ISO11452-2 can be solved using the hybrid Finite Element Boundary Integral (FEBI) approach. A comparative study indicates that FEBI is faster and requires less computational effort than the Finite Element Method (FEM) for this particular analysis. Recent technology advances on FEBI are also presented showing the great potential of this technique to address automotive EMC problems.
Keywords :
automobile industry; automotive electronics; boundary integral equations; electromagnetic compatibility; finite element analysis; CEM; FEBI; FEM; automotive EMC analysis; automotive industry; automotive manufacturer; automotive standard ISO11452-2; computational electromagnetic modeling; electromagnetic behavior; electromagnetic compatibility problem; electronic control unit; finite element method; hybrid finite element boundary integral approach; Atmospheric modeling; Automotive engineering; Finite element analysis; Mathematical model; Numerical models; Vehicles; Wiring;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4799-0408-2
DOI :
10.1109/ISEMC.2013.6670499