DocumentCode
646792
Title
Prediction of radiated emission for complex systems under Realistic Operating Conditions
Author
Hamann, David ; Battermann, Sven ; Mleczko, Marcin ; Garbe, Heyno
Author_Institution
Inst. of Electr. Eng. & Meas. Technol., Leibniz Univ. Hannover, Hannover, Germany
fYear
2013
fDate
5-9 Aug. 2013
Firstpage
757
Lastpage
762
Abstract
Today´s electronic devices are complex systems often consisting of different subsystems that tend to have radio frequency communication interfaces as well as interconnecting cables to auxiliary equipment required for electromagnetic compatibility testing. In many cases the subsystems are developed in different departments or even in different companies. This paper describes measurement techniques for such subsystems, including the possibility to establish radio frequency links to auxiliary equipment or other subsystems during the measurement of radiated emission. Based on transverse electromagnetic (TEM) waveguide measurements with the subsystems a prediction of the radiated emission of the complex system becomes possible before it´s prototype needs to be assembled. The analysis of the accumulated intermediate measurement data gives additional information for the optimization of the electromagnetic radiation of the system. An estimate for the directivity of each subsystem can be obtained.
Keywords
electromagnetic compatibility; optimisation; TEM waveguide measurements; auxiliary equipment; complex systems; electromagnetic compatibility testing; electromagnetic radiation; electronic devices; interconnecting cables; optimization; radiated emission mesurement; radiated emission prediction; radio frequency communication interfaces; radio frequency links; subsystem directivity; transverse electromagnetic waveguide measurements; Antenna measurements; Antennas; Electromagnetic compatibility; Electromagnetic waveguides; Frequency measurement; Ports (Computers); Position measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
Conference_Location
Denver, CO
ISSN
2158-110X
Print_ISBN
978-1-4799-0408-2
Type
conf
DOI
10.1109/ISEMC.2013.6670511
Filename
6670511
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