DocumentCode :
646795
Title :
Electromagnetic interference shielding effects in wireless power transfer using magnetic resonance coupling for board-to-board level interconnection
Author :
Sukjin Kim ; Hongseok Kim ; Kim, Jonghoon J. ; Bumhee Bae ; Sunkyu Kong ; Joungho Kim
Author_Institution :
Terahertz Interconnection & Package Lab., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
fYear :
2013
fDate :
5-9 Aug. 2013
Firstpage :
773
Lastpage :
778
Abstract :
In this paper, we present the analysis of electromagnetic interference (EMI) shielding effects of wireless power transfer (WPT) using magnetic resonance coupling for board-to-board level interconnection. Board-to-board WPT consists of source coil, receiver coil, and load which are manufactured on printed circuit board (PCB). The coil is expressed as a simple equivalent circuit model, of which the components are calculated using the physical dimensions of the coil. It is verified that the results of model estimation in both frequency- and time-domain show a good correlation with simulated and measured results under 1GHz. Voltage transfer ratio (VTR) of board-to-board WPT was achieved to be 0.49. In addition, EMI shielding effects in WPT with materials such as ferrite and metal film is analyzed using verified model. The shielding effects of each film in WPT are compared by observing their magnetic field distribution.
Keywords :
electromagnetic interference; electromagnetic shielding; frequency-domain analysis; printed circuits; time-domain analysis; EMI shielding effects; board-to-board WPT; board-to-board level interconnection; electromagnetic interference shielding effects; frequency-domain; magnetic resonance coupling; printed circuit board; receiver coil; simple equivalent circuit model; source coil; time-domain; voltage transfer ratio; wireless power transfer; Coils; Electromagnetic interference; Equivalent circuits; Integrated circuit modeling; Materials; Resonant frequency; Video recording;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
Conference_Location :
Denver, CO
ISSN :
2158-110X
Print_ISBN :
978-1-4799-0408-2
Type :
conf
DOI :
10.1109/ISEMC.2013.6670514
Filename :
6670514
Link To Document :
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