DocumentCode
646795
Title
Electromagnetic interference shielding effects in wireless power transfer using magnetic resonance coupling for board-to-board level interconnection
Author
Sukjin Kim ; Hongseok Kim ; Kim, Jonghoon J. ; Bumhee Bae ; Sunkyu Kong ; Joungho Kim
Author_Institution
Terahertz Interconnection & Package Lab., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
fYear
2013
fDate
5-9 Aug. 2013
Firstpage
773
Lastpage
778
Abstract
In this paper, we present the analysis of electromagnetic interference (EMI) shielding effects of wireless power transfer (WPT) using magnetic resonance coupling for board-to-board level interconnection. Board-to-board WPT consists of source coil, receiver coil, and load which are manufactured on printed circuit board (PCB). The coil is expressed as a simple equivalent circuit model, of which the components are calculated using the physical dimensions of the coil. It is verified that the results of model estimation in both frequency- and time-domain show a good correlation with simulated and measured results under 1GHz. Voltage transfer ratio (VTR) of board-to-board WPT was achieved to be 0.49. In addition, EMI shielding effects in WPT with materials such as ferrite and metal film is analyzed using verified model. The shielding effects of each film in WPT are compared by observing their magnetic field distribution.
Keywords
electromagnetic interference; electromagnetic shielding; frequency-domain analysis; printed circuits; time-domain analysis; EMI shielding effects; board-to-board WPT; board-to-board level interconnection; electromagnetic interference shielding effects; frequency-domain; magnetic resonance coupling; printed circuit board; receiver coil; simple equivalent circuit model; source coil; time-domain; voltage transfer ratio; wireless power transfer; Coils; Electromagnetic interference; Equivalent circuits; Integrated circuit modeling; Materials; Resonant frequency; Video recording;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
Conference_Location
Denver, CO
ISSN
2158-110X
Print_ISBN
978-1-4799-0408-2
Type
conf
DOI
10.1109/ISEMC.2013.6670514
Filename
6670514
Link To Document