• DocumentCode
    646795
  • Title

    Electromagnetic interference shielding effects in wireless power transfer using magnetic resonance coupling for board-to-board level interconnection

  • Author

    Sukjin Kim ; Hongseok Kim ; Kim, Jonghoon J. ; Bumhee Bae ; Sunkyu Kong ; Joungho Kim

  • Author_Institution
    Terahertz Interconnection & Package Lab., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
  • fYear
    2013
  • fDate
    5-9 Aug. 2013
  • Firstpage
    773
  • Lastpage
    778
  • Abstract
    In this paper, we present the analysis of electromagnetic interference (EMI) shielding effects of wireless power transfer (WPT) using magnetic resonance coupling for board-to-board level interconnection. Board-to-board WPT consists of source coil, receiver coil, and load which are manufactured on printed circuit board (PCB). The coil is expressed as a simple equivalent circuit model, of which the components are calculated using the physical dimensions of the coil. It is verified that the results of model estimation in both frequency- and time-domain show a good correlation with simulated and measured results under 1GHz. Voltage transfer ratio (VTR) of board-to-board WPT was achieved to be 0.49. In addition, EMI shielding effects in WPT with materials such as ferrite and metal film is analyzed using verified model. The shielding effects of each film in WPT are compared by observing their magnetic field distribution.
  • Keywords
    electromagnetic interference; electromagnetic shielding; frequency-domain analysis; printed circuits; time-domain analysis; EMI shielding effects; board-to-board WPT; board-to-board level interconnection; electromagnetic interference shielding effects; frequency-domain; magnetic resonance coupling; printed circuit board; receiver coil; simple equivalent circuit model; source coil; time-domain; voltage transfer ratio; wireless power transfer; Coils; Electromagnetic interference; Equivalent circuits; Integrated circuit modeling; Materials; Resonant frequency; Video recording;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
  • Conference_Location
    Denver, CO
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4799-0408-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2013.6670514
  • Filename
    6670514