Title :
Board-Level Functional Fault Diagnosis Using Multikernel Support Vector Machines and Incremental Learning
Author :
Fangming Ye ; Zhaobo Zhang ; Chakrabarty, Krishnendu ; Xinli Gu
Author_Institution :
Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
Abstract :
Advanced machine learning techniques offer an unprecedented opportunity to increase the accuracy of board-level functional fault diagnosis and reduce product cost through successful repair. Ambiguous or incorrect diagnosis results lead to long debug times and even wrong repair actions, which significantly increase repair cost. We propose a smart diagnosis method based on multikernel support vector machines (MK-SVMs) and incremental learning. The MK-SVM method leverages a linear combination of single kernels to achieve accurate faulty-component classification based on the errors observed. The MK-SVMs thus generated can also be updated based on incremental learning, which allows the diagnosis system to quickly adapt to new error observations and provide even more accurate fault diagnosis. Two complex boards from industry, currently in volume production, are used to validate the proposed diagnosis approach in terms of diagnosis accuracy (success rate) and quantifiable improvements over previously proposed machine-learning methods based on several single-kernel SVMs and artificial neural networks.
Keywords :
electronic engineering computing; fault diagnosis; learning (artificial intelligence); neural nets; printed circuit testing; support vector machines; MK-SVM method; advanced machine learning technique; artificial neural network; board level functional fault diagnosis; faulty component classification; linear combination; multikernel support vector machine; smart diagnosis method; Accuracy; Circuit faults; Fault diagnosis; Kernel; Maintenance engineering; Support vector machines; Training; Board-level fault diagnosis; functional failures; incremental learning; kernel; machine learning; support-vector machines;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
DOI :
10.1109/TCAD.2013.2287184