DocumentCode :
64736
Title :
Letter from the editor
Volume :
2
Issue :
4
fYear :
2013
fDate :
4th Quarter 2013
Firstpage :
4
Lastpage :
8
Abstract :
Welcome to our annual symposium issue that features news from the 2013 IEEE International Symposium on Electromagnetic Compatibility (EMC) held in Denver, Colorado. I hope you enjoy the many articles on symposium activity and appreciate the photos contributed by our capable team of EMC Society photographers shown on page 8. Their photos help bring the articles to life and provide recognition for the speakers, exhibitors, the countless volunteers, the awardees and others who contributed to the success of the symposium.
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility Magazine, IEEE
Publisher :
ieee
ISSN :
2162-2264
Type :
jour
DOI :
10.1109/MEMC.2013.6714685
Filename :
6714685
Link To Document :
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