DocumentCode
64736
Title
Letter from the editor
Volume
2
Issue
4
fYear
2013
fDate
4th Quarter 2013
Firstpage
4
Lastpage
8
Abstract
Welcome to our annual symposium issue that features news from the 2013 IEEE International Symposium on Electromagnetic Compatibility (EMC) held in Denver, Colorado. I hope you enjoy the many articles on symposium activity and appreciate the photos contributed by our capable team of EMC Society photographers shown on page 8. Their photos help bring the articles to life and provide recognition for the speakers, exhibitors, the countless volunteers, the awardees and others who contributed to the success of the symposium.
fLanguage
English
Journal_Title
Electromagnetic Compatibility Magazine, IEEE
Publisher
ieee
ISSN
2162-2264
Type
jour
DOI
10.1109/MEMC.2013.6714685
Filename
6714685
Link To Document