• DocumentCode
    64838
  • Title

    Book review: Design and modeling for 3D ICs and interposers

  • Author

    Orlandi, Antonio ; Swaminathan, Madhavan ; Han, Ki Jin

  • Volume
    2
  • Issue
    4
  • fYear
    2013
  • fDate
    4th Quarter 2013
  • Firstpage
    48
  • Lastpage
    49
  • Abstract
    It appears that 3D integration with through silicon vias (TSV) is finally here! I am referring to the mem-ory-on-logic and logic-on-logic applications where the improvement in performance, transistor density and form factor enables the electronics industry to continue the miniaturization of systems. Because of this, the timing of this book is about right.
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    2162-2264
  • Type

    jour

  • DOI
    10.1109/MEMC.2013.6714696
  • Filename
    6714696
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=64838