• DocumentCode
    648690
  • Title

    Dynamic cache pooling for improving energy efficiency in 3D stacked multicore processors

  • Author

    Jie Meng ; Tiansheng Zhang ; Coskun, Ayse K.

  • Author_Institution
    Electr. & Comput. Eng. Dept., Boston Univ., Boston, MA, USA
  • fYear
    2013
  • fDate
    7-9 Oct. 2013
  • Firstpage
    210
  • Lastpage
    215
  • Abstract
    Resource pooling, where multiple architectural components are shared among multiple cores, is a promising technique for improving the system energy efficiency and reducing the total chip area. 3D stacked multicore processors enable efficient pooling of cache resources owing to the short interconnect latency between vertically stacked layers. This paper introduces a 3D multicore architecture that provides poolable cache resources. We propose a runtime policy that improves energy efficiency in 3D stacked processors by providing flexible heterogeneity of the cache resources. Our policy dynamically allocates jobs to cores on the 3D stacked system in a way that pairs applications with contrasting cache use, while also partitioning the cache resources based on the cache hungriness of the applications. Experimental results demonstrate that the proposed policy improves system energy-delay product (EDP) and energy-delay-area product (EDAP) by up to 39.2% and 57.2%, respectively, compared to 3D processors with static cache sizes.
  • Keywords
    cache storage; integrated circuit design; low-power electronics; multiprocessing systems; processor scheduling; three-dimensional integrated circuits; 3D stacked multicore processor; cache hungriness; cache resource efficient pooling; cache resource partitioning; cache use; dynamic cache pooling; dynamic job allocation; energy efficiency improvement; multiple architectural component; resource pooling; runtime policy; short interconnect latency; vertically stacked layer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Very Large Scale Integration (VLSI-SoC), 2013 IFIP/IEEE 21st International Conference on
  • Conference_Location
    Istanbul
  • Type

    conf

  • DOI
    10.1109/VLSI-SoC.2013.6673277
  • Filename
    6673277