• DocumentCode
    649072
  • Title

    Signal processing challenges for emerging digital intensive and digitally assisted transceivers with deeply scaled technology (Invited)

  • Author

    Min Li ; Khalaf, Kinda ; Chunshu Li ; Vojkan, Vidojkovic ; Ingels, M. ; Bourdoux, Andre ; Wambacq, Piet ; Craninckx, Jan ; Van der Perre, Liesbet

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    2013
  • fDate
    16-18 Oct. 2013
  • Firstpage
    324
  • Lastpage
    329
  • Abstract
    Mainstream foundries are leaping toward 14nm node and beyond. Although aggressive scaling can substantially improve digital circuit, it is very controversial for analog circuit. However, analog circuit still has to follow the scaling trend because a single chip integration offers key commercial advantages. To optimally achieve the best performance/power/cost tradeoff with deeply scaled technology nodes, there is a clear trend and paradigm shift towards digital intensive and digitally assisted transceivers. Successes of such transceivers have been proven for individual transceiver components and narrow band systems. When targeting emerging communication standards, higher carrier frequencies, further technology scaling and reconfigurable radios, required signal processing design and implementation are orders of magnitudes more challenging but potential gains are promising. Illustrated with a variety of transceivers representing emerging architectures designed for different sub-6GHz and 60GHz communication systems, we will depict key challenges that we experienced in our design and optimization process with 40nm and 28nm technology nodes.
  • Keywords
    analogue circuits; digital circuits; optimisation; radio transceivers; signal processing; software radio; telecommunication standards; analog circuit; communication standards; deeply scaled technology; digital circuit; digital intensive transceivers; digitally assisted transceivers; frequency 6 GHz; frequency 60 GHz; optimization; reconfigurable radios; signal processing; size 28 nm; size 40 nm; transceiver components;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Processing Systems (SiPS), 2013 IEEE Workshop on
  • Conference_Location
    Taipei City
  • ISSN
    2162-3562
  • Type

    conf

  • DOI
    10.1109/SiPS.2013.6674527
  • Filename
    6674527