DocumentCode
649214
Title
Static noise margin and power dissipation analysis of various SRAM topologies
Author
Mishra, P. ; John, Eugene ; Wei-Ming Lin
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Texas at San Antonio, San Antonio, TX, USA
fYear
2013
fDate
4-7 Aug. 2013
Firstpage
469
Lastpage
472
Abstract
In this paper we analyze and compare 8 different SRAM cell topologies that are suitable for low power embedded memory design in terms of power consumption, area, static noise margin (SNM) and read and write delays, which are the basic parameters affecting the performance of an SRAM cell. The circuit simulation and analysis were carried out using HSPICE for 45 nm technology node. The SNM of each cell is examined analytically using SLL (Seevinck, List and Lohstroh) method. Throughout the design and analysis VDD is kept at 1.2V. For the determination of Read and Write Margin of SRAM cells, the cell ratio is kept at 3 and the pull up ratio is kept at 2 throughout the design. Our results will enable memory circuit designers to choose the appropriate SRAM cell for the required SNM and power consumption.
Keywords
SPICE; SRAM chips; circuit simulation; embedded systems; integrated circuit design; integrated circuit noise; low-power electronics; memory architecture; network topology; power consumption; HSPICE; SLL method; SNM; SRAM cell performance; SRAM cell topologies; Seevinck-List-Lohstroh method; cell ratio; circuit simulation; low power embedded memory design; memory circuit design; power consumption; power dissipation analysis; pull up ratio; read and write delays; read and write margin; size 45 nm; static noise margin; voltage 1.2 V;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (MWSCAS), 2013 IEEE 56th International Midwest Symposium on
Conference_Location
Columbus, OH
ISSN
1548-3746
Type
conf
DOI
10.1109/MWSCAS.2013.6674687
Filename
6674687
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