DocumentCode
649485
Title
Analysis of the effectiveness of core swapping in modern multicore processors
Author
Zajac, Piotr ; Szermer, Michal ; Janicki, Marcin ; Maj, Cezary ; Pietrzak, P. ; Napieralski, A.
Author_Institution
Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland
fYear
2013
fDate
25-27 Sept. 2013
Firstpage
385
Lastpage
388
Abstract
One of the interesting thermal management techniques for multi-core processors is core swapping. In this paper, using the published power data and floorplans for two modern high-performance processors, we employ the well-known HotSpot tool to perform the thermal simulation of the core swapping mechanism. Our transient simulations show that by using core swapping technique, it was possible to either minimize the hot spot temperature in the Ivy Bridge chip by 5°C or increase the operating frequency by 17% and maintain the same temperature as in the case without core swapping. We also derive an analytical model of the activity migration mechanism between two cores which may serve as a tool to calculate the swapping frequency given the desired maximal temperature drop. The model also allows for the correlation of the cooling effectiveness with the performance penalty induced by the swapping.
Keywords
microprocessor chips; thermal management (packaging); HotSpot tool; Ivy Bridge chip; activity migration mechanism; core swapping mechanism; floorplans; multicore processors; published power data; swapping frequency; thermal management techniques; thermal simulation; transient simulations;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on
Conference_Location
Berlin
Print_ISBN
978-1-4799-2271-0
Type
conf
DOI
10.1109/THERMINIC.2013.6675178
Filename
6675178
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