• DocumentCode
    649501
  • Title

    Empirical feasibility assessment of energy scavenging opportunity in compact mobile computers

  • Author

    Khan, Mohammad A. A. ; Muhtaroglu, Ali

  • Author_Institution
    Middle East Tech. Univ. Northern Cyprus Campus, Guzelyurt, Cyprus
  • fYear
    2013
  • fDate
    25-27 Sept. 2013
  • Firstpage
    331
  • Lastpage
    334
  • Abstract
    The opportunity of thermoelectric energy scavenging from waste heat of a compact and thermally limited notebook computer is experimentally studied in this paper. Thermal characterization of the target computer is done under a range of workloads/activity levels. A detailed finite element model of the system is developed for thermal simulations and the results are validated by the ones obtained in the thermal characterization. A suitable spot is selected based on the finite element model for integration of thermoelectric module into the cooling solution without impacting the system performance, as measured by thermal changes in the simulation model. A significant difference of approximately 22 °C is observed between the hot and cold side of thermoelectric module when the system is executed at maximum workload resulting in a net power generation of 410.5 μW. The generated power scales down to 60.5 μW when the system is idle. It has been verified through lab experiments that the integration of thermoelectric module to a thermally limited notebook system can be done without any substantial degradation in performance.
  • Keywords
    cooling; energy harvesting; finite element analysis; notebook computers; power aware computing; thermal analysis; thermoelectric conversion; compact mobile computers; cooling solution; detailed finite element model; empirical feasibility assessment; energy scavenging opportunity; notebook computer; power 410.5 muW; power 60.5 muW; thermal simulation; thermoelectric energy scavenging; thermoelectric module; waste heat;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4799-2271-0
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2013.6675194
  • Filename
    6675194