Title :
Novel approach to compact modeling for nonlinear thermal conduction problems
Author_Institution :
Dipt. di Elettron., Inf. e Bioingegneria, Politec. di Milano, Milan, Italy
Abstract :
In this paper a novel approach is proposed for generating dynamic compact models of nonlinear heat diffusion problems for electronics components. The method is very efficient and leads to accurate approximations of the space-time distribution of temperature rise within the component for all waveforms of the injected powers.
Keywords :
electronics packaging; thermal diffusion; dynamic compact model; electronics component; nonlinear heat diffusion problem; nonlinear thermal conduction problem; space-time distribution; temperature rise;
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on
Conference_Location :
Berlin
Print_ISBN :
978-1-4799-2271-0
DOI :
10.1109/THERMINIC.2013.6675220
